JPH0750144Y2 - ハブ付き極薄刃砥石 - Google Patents
ハブ付き極薄刃砥石Info
- Publication number
- JPH0750144Y2 JPH0750144Y2 JP1988057780U JP5778088U JPH0750144Y2 JP H0750144 Y2 JPH0750144 Y2 JP H0750144Y2 JP 1988057780 U JP1988057780 U JP 1988057780U JP 5778088 U JP5778088 U JP 5778088U JP H0750144 Y2 JPH0750144 Y2 JP H0750144Y2
- Authority
- JP
- Japan
- Prior art keywords
- hub
- abrasive grain
- grain layer
- grindstone
- ultra
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000006061 abrasive grain Substances 0.000 claims description 43
- 230000002093 peripheral effect Effects 0.000 claims description 19
- 230000000694 effects Effects 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988057780U JPH0750144Y2 (ja) | 1988-04-28 | 1988-04-28 | ハブ付き極薄刃砥石 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988057780U JPH0750144Y2 (ja) | 1988-04-28 | 1988-04-28 | ハブ付き極薄刃砥石 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01163063U JPH01163063U (en]) | 1989-11-14 |
JPH0750144Y2 true JPH0750144Y2 (ja) | 1995-11-15 |
Family
ID=31283622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988057780U Expired - Lifetime JPH0750144Y2 (ja) | 1988-04-28 | 1988-04-28 | ハブ付き極薄刃砥石 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0750144Y2 (en]) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4825292A (en]) * | 1971-08-05 | 1973-04-02 | ||
JPS6016098A (ja) * | 1983-07-07 | 1985-01-26 | Foster Denki Kk | スピ−カ用振動板 |
-
1988
- 1988-04-28 JP JP1988057780U patent/JPH0750144Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01163063U (en]) | 1989-11-14 |
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